The way a computer chip is assembled with other components can lead to major performance improvements.
M1 Ultra — How Apple DESTROYED Nvidia
Apple's new M1 Ultra chips take advantage of advances in a type of chipmaking called packaging. The company's UltraFusion, the name of the packaging technology, connects two M1 Max chips using 10,000 wires that can carry 2.5 terabytes of data per second. The process is part of a growing revolution in chip packaging.
“Advanced packaging is an important and emerging area of microelectronics,” Janos Veres, the director of engineering at NextFlex, a consortium working to improve the production of printed flexible electronics, told Lifewire in an email interview. “It typically involves integrating several mold-level components, such as analog, digital or even optoelectronic ‘chiplets’ into a complex package.”
Apple built its new M1 Ultra chip by combining two M1 Max chips using UltraFusion, Apple's custom packaging method.
